127 Millennium - Twenty-fourth Edition SCIENCE, TECHNOLOGY AND ENGINEERING His work had worldwide applications for clients such as TSMC, Intel, Micron Technology and Samsung Electronics. Mr. Yang previously led CVD contact development for N7 nodes as the technical manager of TSMC's research and development team. In his earlier role as a senior engineer on the development team at Applied Materials, he led the introduction of the first dielectric dry etching product into TSMC production. He also led the first new PVD barrier process production at TSMC. Mr. Yang’s expertise extends beyond technological innovation to people management. As the senior manager of regional process support engineering East at ASM, he was responsible for a global customer support team focused on Eastern clients, working with internal research and development personnel and supporting functional team members at the company’s branch in Hsinchu, Taiwan. Creative thinking and innovation have been critical to Mr. Yang’s professional success, and he advises that these characteristics are essential for enhancing workplace motivation. Looking forward, he emphasizes the need for a more active approach to support and energize efforts, adding that such strategies can positively impact both the quality of work and team engagement. metallization seed layer for overhang and sidewall improvement, and in the compensation of spacing between magnetron and sputter target, among others. These patents have directly improved chip manufacturing, and his inventions and processes have been embedded in the chips used in Apple phones beginning with the iPhone 7. Additionally, Mr. Yang has contributed to several written works and presentations. He is the co-author of “Off-Angular Deposition Compensation for PVD Selective Re-sputtering Process,” published in the Materials Research Society Conference Proceedings, and “New PVD Source for Copper Technology at 65nm and Beyond,” published in the Nanochip Technology Journal. He delivered presentations at the Materials Research Society Conference in 2008 and at the Applied Materials Internal Technology Conference in 2002. Mr. Yang describes himself as “technical” and is dedicated and devoted to his work. His advances in chip processing have generated substantial business for his current and previous companies. As a result, he has been entrusted with numerous leadership responsibilities over the years. In 2024, as Applied Materials’ director of process engineering, Mr. Yang led PVD product development specifically for copper barrier and seed applications in back-end-of-line processes.
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